Ultra-Precision dispensing Device MsL [Smartphone Component Assembly/Flip Chip]
Achieving high precision/high-speed processing (linear drive: ±5μm)! Proposing high precision/high functionality in the implementation of smartphone components and the flip chip field!
Sinwa Ultra-Precision Dispenser 【MsL】 - Semiconductor back-end processes (mainly Flip-chip Underfill) → Achieves high precision/high-speed processing! (X-Y repeat accuracy: ±5μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Improved stability of application amount due to room temperature discharge! → Significant reduction in yield loss, greatly improved production efficiency 【Applications】 ◆ Flip-chip Underfill ◆ MEMS & HDD ◆ General LED phosphors (SMD/side view/Dam & Fill, etc.) ◆ Cream solder (MIN: φ150μm) ◆ Ag paste ◆ UV curing resin, among others
- Company:Shinwa Co., Ltd. Mechatronics System Center
- Price:Other